Nova ASTERA™ Integrated Metrology System
A First of its kind In the Industry
The Nova ASTERA™ provides stand-alone level performance in a compact form factor of integrated metrology. Utilizing oblique and normal incidence channel measurements, Nova ASTERA™ provides an unmatched level of accuracy, precision, tool-to-tool matching and extendibility.
Highlights and Benefits
- Uniquely suited to support R&D challenges in the most advanced nodes
- Best metrology performance
- Best IM solution for complex 3D structures
- Advanced algorithmic modeling suite providing the fastest application time-to-solution
Semiconductors manufacturers face multiple process complexities, growing challenges in development time and difficulties of yield improvements. This in turn, raises demands for tighter specs and smaller process windows – and metrology solutions that reduce overall measurement uncertainty. The ever-growing fabrication complexity dictates the need to measure in-die with minimal within-wafer and within-die variation, which requires the highest levels of measurement accuracy.
Nova ASTERA™ brings an unmatched capability to the world of integrated metrology, enabling robust measurement for challenging OCD applications in DRAM, 3DNAND and Logic. The platform offers the fastest available application time-to-solution, utilizing advanced physical and machine learning algorithms. The platform’s rich spectral information content gathered through multiple channels provide the necessary sensitivity for solving complex 3D Optical CD applications that require monitoring a growing number of parameters.
Nova ASTERA™ is targeted to support the development of the most advanced device technologies, beyond 3nm Logic nanosheet architecture and 256 Layers, multi-deck 3D-NAND nodes.
The Nova ASTERA™ platform is supported by Nova’s central fleet management, control and connectivity suite for boosted operational efficiency and advanced metrology control functionality.