Unique spectral interferometry solutions for complex high aspect ratio 3D NAND structures (12955-60)
Session 12 | Jaesuk Yoon, SAMSUNG (Korea)
29 February, 4:00 PM
Spectral interferometry for TSV metrology in chiplet technology (12955-56)
Session 11 | Stefan Schoeche, IBM (USA)
29 February, 2:10 PM
From lab to fab: In-line SIMS for process control in Nanosheet Gate-All-Around device manufacturing (12955-7)
Session 2 | Stefan Schoeche, IBM (USA)
26 February, 4:30 PM
On-cell thickness monitoring of chalcogenide alloy layer using spectral interferometry, Raman spectroscopy, and hybrid machine learning (12955-14)
Session 3 | Hyunwoo Ryoo, SAMSUNG (Korea)
27 February, 11:20 AM