Nova VERAFLEX® III+ XF
In-Line XPS and XRF System
The VeraFlex® III+ XF system is a fourth-generation inline x-ray photoelectron spectroscopy (XPS) tool featuring hardware innovations that enhance our customers’ ability for thin film metrology and process control. In the XF configuration, customers have additional capability for simultaneous x-ray fluorescence (XRF) spectroscopy that expands the application space.
Highlights and Benefits
- Planar, On-Structure and In-Die Applications
- Direct measurement of ultra-thin layers and multilayer stacks
- Improved precision for non-stoichiometric films and dopant detection
- New applications enabled for <10nm Logic, >64L VNAND and new memories (MRAM, PCRAM) with simultaneous XPS and XRF capability
On a first-principles basis, the quality of data from an XPS system depends on maximizing photoelectron collection. This can be achieved by improving the incoming current and enlarging the available analysis area.
VeraFlex III+ features a unique electron gun that enables fifty percent higher photoelectron flux. The system is also equipped with small and large beam tunability. Combined, these engineering innovations provide customers with maximum flexibility to improve sensitivity, precision and overall system productivity for a wide application range.
Along with flux enhancement, VeraFlex III+ features state-of-the-art solutions for system reliability, productivity and fleet matching.