Nova VERAFLEX® III+

Measurements on 2D pads or in-die add value by offering customers measurement location options. In-die measurements typically maintain the highest correlation to electrical performance

Directly measures the photoelectrons from a single ultra-thin layer or multiple layer stack. This is superior to optical methods, which convolve thickness and optical properties, by using a direct uncorrelated measurement of thickness and composition resulting in the only viable solution for ultra-thin film and complex stacks

Provides improved results for films comprised of dopants or non-proportional elemental compositions

Enables new applications for emerging thinner films and film structures in advanced Memory and Logic with simultaneous XPS and XRF capabilities. The combination of XPS and LE-XRF addresses dose and thickness measurements of complex films simultaneously