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Materials Metrology
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Secondary Ion Mass Spectrometry (SIMS)

Secondary Ion Mass Spectrometry (SIMS)

Nova Metrion® leverages secondary ion mass spectrometry (SIMS) technology to provide information that no other inline metrology system can deliver.  This includes direct, inline measurement of chemical composition at high depth resolution and data density, as well as simultaneous measurement of multiple species throughout a 300mm wafer’s film stack.  Process automation with built-in film analysis and recipe management makes the Nova Metrion® system easy to use, while performing these measurements in the production fab shortens time to results.

Secondary Ion Mass Spectrometry (SIMS)

Highlights and Benefits

Direct Composition Profiling 

Built-in Film Analysis

Full Factory Automation

Contamination Free

Whole Wafer Measurements 

Reduced Scrap and Enhanced Yield

Direct Composition Profiling 

Built-in Film Analysis

Full Factory Automation

Contamination Free

Whole Wafer Measurements 

Reduced Scrap and Enhanced Yield

Direct Composition Profiling 

Directly measures compositional profiles inline at high depth resolution and data density

Built-in Film Analysis

Simplifies measurements and accelerates process insight with built-in film analysis and recipe management

Full Factory Automation

Supports full factory automation to enable high-volume manufacturing

Contamination Free

Ensures worry-free use within contaminant-sensitive production environments

Whole Wafer Measurements 

Eliminates sample preparation and enables multi-point measurements for wafer uniformity mapping

Reduced Scrap and Enhanced Yield

Faster time to results reduces scrap and improves yield to deliver fast return on investment (ROI)

Nova VeraFlex® III

Why Inline SIMS?

Delivering time-sensitive information needed to monitor and control high-volume manufacturing (HVM) workflows, inline SIMS prevents scrap, reduces rework, and enables tighter statistical process control (SPC).

What is SIMS?

Related Products and Technologies

Nova Metrion®
Nova Elipson®
Raman Spectroscopy
X-Ray Fluorescence (XRF)

Our Blog

Nova Metrion®: Analyzing Materials Composition of Complex Stacks
Nova Metrion® directly measures the composition of wafer materials using Secondary Ion Mass Spectr...
Sarah Okada
23 Nov, 2022

Nova Metrion® Use Cases
In our companion blog post covering Metrion we explored the importance of SIMS technology for se...
Sarah Okada
30 Nov, 2022

Marla Fields Redefines Limits One Step Forward at a Time- and Inspires Young Girls to do the Same
A good advice from her high school teacher lead Marla Fields to make a life-changing choice about h...
Nova Team
17 Jan, 2022
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Press Releases

Nova Introduces Revolutionary Inline SIMS Solution

Nova Introduces Revolutionary Inline SIMS Solution

08 Dec, 2021
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Nova Introduces Unique Portfolio to Address Next-Generation Logic Fabrication Challenges

Nova Introduces Unique Portfolio to Address Next-Generation Logic Fabrication Challenges

17 Feb, 2022
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Nova Metrion® Selected by Advanced Logic Manufacturer

Nova Metrion® Selected by Advanced Logic Manufacturer

12 Jul, 2022
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Nova Receives Multiple Materials Metrology Orders from Leading Logic and Foundry Customers

Nova Receives Multiple Materials Metrology Orders from Leading Logic and Foundry Customers

28 Jan, 2021
Read More

Our Publications

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2020
Optimization of Scatterometry Measurements by Enhancing with Machine Learning
April 2024
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SPIE
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Authored by: Sasmita Srichandan, Franz Heider, Georg Ehrentraut, Stephan Lilje, Christian Putzi, Sanja Radosavljevic, Egidijus Sakalauskas
On-Cell Thickness Monitoring of Chalcogenide Alloy Layer usingSpectral Interferometry, Raman spectroscopy, and Hybrid Machine Learning
April 2024
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SPIE
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Authored by: Hyunwoo Ryoo*a, Seul Ji Songb, Min Ji Jeona, Juhyun Moonb, JiHye Leea, ByungHyun Hwanga, Jeongho Ahna, Yoon-jong Songb, Hidong Kwaka, Lior Neemanc, Noga Meirc, Jaehong Jangd, Ik Hwan Kimd, Hyunkyu Kimd
From Lab to Fab: In-line SIMS for Process Control in Semiconductor Manufacturing
April 2024
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Authored by: Stefan Schoeche*a, Katherine Siega, Daniel Schmidta, Mohsen Nasseria, Shogo Mochizukia, Marinus Hopstakenb, Yaguang Zhuc, Li Xiangc, Julia Hoffmanc, Daniel Lewellync, Paul Isbesterc, and Sarah Okadac
Unique Spectral Interferometry solutions for complex High AspectRatio 3D NAND structures
April 2024
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SPIE
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Authored by: Jaesuk Yoona, Jongmin Parka, Minjung Shina, and Dongchul Ihma, Oshrat Bismuthb, Smadar Ferberb, Jacob Ofekb, Igor Turovetsb, Isaac Kim, aFlash Process Development Team MI, Samsung R&D Center, Hwaseong, Korea, NOVA Ltd, Rehovot, Israel, Nova Measuring Instruments Korea Ltd., Gyeonggi-do, Korea.
A Flexible Deep Learning Based Approach for SEM Image Denoising
April 2024
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SPIE
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Authored by: Jun Chen, Xinheng Jiang, Keisuke Goto, Takashi Tsutsumi, Yasutaka Toyoda Hitachi High-tech Corp.,
Spectral Interferometry for TSV Metrology in Chiplet Technology
April 2024
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Authored by: Stefan Schoeche, Daniel Schmidt, Junwon Han, Shahid Butt, Katherine Sieg, Marjorie Cheng, Aron Cepler, Shaked Dror, Jacob Ofek, Ilya Osherov, and Igor Turovetsc IBM Research, 257 Fuller Road, Albany, NY 12203, USA Nova Measuring Instruments Inc., 3342 Gateway Blvd, Fremont, CA 94538, USA Nova Ltd., 5 David Fikes St., Rehovot, 7632805, Israel

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