Nova offers a market-leading portfolio of advanced, open and flexible chemical metrology platforms for semiconductor backend wafer-level packaging and front-end damascene process steps. Our portfolio helps manufacturers ensure high-quality electroplating processes by carrying out real-time chemical analysis and replenishment.
The demand for chemical measurements has grown significantly over the past few years, driven by the number of interconnect process steps and material purity at the front end, and by materials complexity in advanced packaging. These trends pushed tighter process windows and increased monitoring frequency - from hours to minutes, in turn leading to a growing number of analytic methods being employed and to raising the bar on metrology complexity.
New device architectures, higher material costs, and tighter environmental regulations are also driving up the costs of operations and increasing the need for manufacturers to carry out chemical process control on more elements and with increasing intensity. With Nova’s extended offering, now customers can harness the company’s global footprint to meet their metrology needs.
Nova Ancolyzer® is a fully automated online chemical metrology platform designed with the most flexible architecture for advanced packaging processes.
Nova DMR® offers economical replenishment of metals in a plating bath.
Nova AncoScene® is an industry-standard chemical metrology solution for Damascene copper plating interconnect applications.
Nova AncoFlex™ is an industry-standard fully automated inline chemical metrology solution for copper PCB and IC-substrate production processes.