Nova VeraFlex® IV

System enhancements have been developed for increasing X-ray flux that generates higher photoelectron count rates and faster processing. This offers substantial throughput improvements while maintaining precise measurement performance

Designed with enhanced X-ray beam alignment and control for smaller next-generation pad sizes

Both XPS and LE-XRF measurements can occur for inline and in-die applications simultaneously, offering unique value to the industry. Inline measurements can be taken both in the scribe line and in-die on-device

Beam parameters from the electron gun and the generated X-ray beam energy are continuously monitored enabling uninterrupted operation

Measurement options on 2D pads and in-die add value by offering customers measurement location options. In-die measurements typically maintain the highest correlation to electrical performance