Innovative Materials Metrology Technology for Thin Film Measurements
As integrated circuits and their components continue to scale, the layers used to fabricate these devices must also become thinner. Today, performance for advanced logic and memory devices depends on a vast array of novel materials, deposited as thin films. These can range from a few atomic layers to several nanometers in thickness. Small variations in composition or miscalculation of even a few atoms can negatively impact both device functionality, and manufacturing yield. As a result, today’s device manufacturers have an even greater need to monitor film composition, and implement process control based on ultra-thin film thickness.
Nova’s materials metrology solutions eliminate the need for lab-based reference metrology, thereby reducing manufacturing downtime and enhancing data quality.