Technologies Overview Software Modeling
High Performance Computing (HPC)

High Performance Computing (HPC)

The Nova MARS® software metrology modeling engine utilizes Nova HPC® systems to accelerate recipe preparation. Based on Microsoft Windows, HPC (WinHPC) server platform. Nova HPC combines scalable, user-configurable infrastructure with Nova’s proprietary task management software to ensure scalability and fault tolerance. Addressing the increasing complexity of IC manufacturing processes, the joint solution also serves as a smart, smooth platform for product analyses.

High Performance Computing (HPC)

Highlights and Benefits

Accelerated Recipe Setup

Scale-as-You-Grow Infrastructure

Cost-Effective Grid Computing

Accelerated Recipe Setup

Scale-as-You-Grow Infrastructure

Cost-Effective Grid Computing

Accelerated Recipe Setup

Uses a parallel computing platform to reduce the time required for new recipe-library building

Scale-as-You-Grow Infrastructure

Designed with flexible, scalable infrastructure that grows according to business needs

Cost-Effective Grid Computing

Leverages existing computing resources to reduce the initial solution and expansion costs

High Performance Computing (HPC)

Why HPC?

In order to accelerate recipe setup time in today’s complex IC manufacturing environment, there is a need for a scalable, cost-effective system that leverages grid computing resources. 

How it Works? 

Nova HPC is based on MS Windows’ WinHPC server platform. The platform enables building libraries and running real-time tasks, while supporting real-time interpretation. WinHPC can scale the computational resources transparently both within the local grid and via external computing power in the cloud. The system utilizes several connected grid subsystems to support various target markets with a single system.

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Press Releases

IBM Research and Nova Jointly Awarded the “Best Metrology Paper” at SPIE Advanced Lithography Conference

IBM Research and Nova Jointly Awarded the “Best Metrology Paper” at SPIE Advanced Lithography Conference

26 Apr, 2022
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Nova Introduces Unique Portfolio to Address Next-Generation Logic Fabrication Challenges

Nova Introduces Unique Portfolio to Address Next-Generation Logic Fabrication Challenges

17 Feb, 2022
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Authored by: Authored by: Daniel SchmidtiD ,a,* Manasa Medikonda,a Michael Rizzolo,a Claire Silvestre,a Julien Frougier,a Andrew Greene,a Mary Breton,a Aron Cepler,b Jacob Ofek,c Itzik Kaplan,c Roy Koret,c and Igor Turovetsc
Authored by: Daniel Doutt*a, Ping-ju Chena, Bhargava Ravooria, Tuyen K. Trana, Eitan Rothsteinb, Nir Kampelb, Lilach Tamamb, Effi Aboodyb, Avron Gerb, Harindra Vedalac
TSV stress evolution mapping using in-line Raman spectroscopy
April 27 2023
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SPIE Advanced Lithography + Patterning
Authored by: Stefan Schoeche, Daniel Schmidt, Marjorie Cheng, Aron Cepler, Abraham Arceo de la Pena, Jennifer Oakley
Authored by: A. Moussa, J. Bogdanowicz, B. Groven, P. Morin, M. Beggiato, M. Saib, G. Santoro, Y. Abramovitz, K. Houtchens, S. Ben Nissim, N. Meir, J. Hung, A. Urbanowicz, R. Koret, I. Turovets, G. F. Lorusso, A.-L. Charley
Authored by: Benjamin Hickey, Wei Ti Li, Sarah Okada, Lawrence Rooney, Feng Zhang
Authored by: Benjamin Hickey, Wei Ti Li, Sarah Okada, Lawrence Rooney, Feng Zhang
Authored by: Julia Hoffman, Sarah Okada, Lawrence Rooney, Bruno Schueler, Ganesh Vanamu