Nova VeraFlex® III

Nova offers the largest global installed base for fully automated XPS and XRF systems in the industry

A fully automated thickness and composition solution for 300mm wafers interfaces seamlessly with all factory automation equipment such as overhead transport (OHT). These systems deliver and retrieve wafers automatically and upload measurement data to a host for statistical process control (SPC)

Both XPS and XRF measurements can occur simultaneously, offering unique value for resolving thickness and composition in complex film stacks

Directly measures the photoelectrons from a single ultra-thin layer or multiple layer stack. This is superior to optical methods, which convolve thickness and optical properties, by using a direct uncorrelated measurement of thickness and composition resulting in the only viable solution for ultra-thin film and complex stacks

Offers compatible sensitivity to all elements except hydrogen and helium, and provides solutions for all process flows (logic, DRAM, 3D-NAND, MRAM, PCRAM)