Join Parikshit Jain for his talk: Accelerating XPS Metrology with AI to Enhance Throughput in High-Volume Semiconductor Manufacturing
Join us on FCMN 2026 for the following sessions:
Wednesday, March 18, Sarah Okada (Nova) | Invited Talk
Inline Metrologies II Technical Session
9:30 – 10:00 AM Impact Assessment of In-Line SIMS Utilization on Logic Device Performance
Dr. Kitty Kumar (Intel) & Ganesh Vanamu (Nova) | Poster Session
Inline XPS and Raman Metrology for Evaluating Graphene Integrity During Thin Film Deposition
Format: In-person fireside chat and one-on-one meetings
When: Tuesday, March 10, fireside chat at 3:10 pm EST
Location: New York, NY
Link to Webcast: https://sqps.onstreamsecure.com/origin/enliven/players/EnlivenPlayer.html?customerId=22&eventId=86754060&checkCompany=1&checkEmail=1&checkName=1
Format: In-person fireside chat and one-on-one meetings
When: Wednesday, March 4, fireside chat at 4:05 pm PT
Location: San Francisco, CA
Link to the webcast: https://event.webcasts.com/starthere.jsp?ei=1753322&tp_key=97c10053d0&tp_special=8
Format: Virtual one-on-one meetings
When: Friday, February 27
Join us at SPIE 2026 where the following presentations will be held:
- The Art of Holistic Metrology (in memory of Alok Vaid) by Igor Turovets, Nova Ltd
CONFERENCE 13981, Metrology, Inspection, and Process Control XL
SESSION 1: Hybrid And Virtual Metrology
23 February, 1:30 PM PST | Convention Center, Grand Ballroom 220B
2.
In-line XPS for advanced semiconductor manufacturing and metrology on fully integrated targets by Christopher J. Lee, IBM Research – Albany (US)
CONFERENCE 13981 Metrology, Inspection, and Process Control XL
SESSION 2 Metrology And Inspection For Advanced Logic Devices
23 February, 4:20 PM PST | Convention Center, Grand Ballroom 220B
3. Model-based Raman simulations for optimized metrology in nanosheet transistor devices by Stefan Schoeche, IBM Research – Albany (US)
CONFERENCE 13981 Metrology, Inspection, and Process Control XL
SESSION 3 Modeling And Data Analysis
24 February, 9:50 AM PST | Convention Center, Grand Ballroom 220B
4.
In-line monitoring of hybrid bonding Cu recess by combining interpolated reference metrology and OCD machine learning by Padraig R. Timoney, IBM Research – Albany (US)
CONFERENCE 13981 Metrology, Inspection, and Process Control XL
SESSION 4 Heterogeneous Integration And Advanced Packaging
24 February, 10:50 AM PST | Convention Center, Grand Ballroom 220B
5. In-line XPS metrology for area selective deposition processes on patterned structures by Manasa Medikonda, IBM Research – Albany (US)
CONFERENCE 13981 Metrology, Inspection, and Process Control XL
SESSION 7 X-Ray Metrology And Inspection
25 February, 9:30 AM PST | Convention Center, Grand Ballroom 220B
6. Evaluation of In-line SIMS impact on device reliability and performance
Poster Session
25 February 2026, 5:30 PM PST
Jander Cruz, IBM Research – Albany (US)
7. Integrated High-Resolution Edge Metrology for Enhanced CMP Process Control
Poster Session
25 February 2026, 5:30 PM PST
Cornel Bozdog, Micron Technology, Inc. (US)
8. SC1100 Scatterometry in Profile, Overlay and Focus Process Control
Course SC1100
22 February 2026, 1:30 PM PST
Hugo Cramer, ASML Netherlands B.V. (Netherlands) & Igor Turovets, Nova Ltd. (Israel)
Guy Kizner, Nova’s Chief Financial Officer, will present at the 28th Annual Needham Growth Conference on Wednesday, January 14, 2026 in New York City.
The fireside chat, moderated by Charles Shi, Senior Research Analyst, is scheduled for 12:45 pm EST, on January 14. A live webcast of the fireside chat will be available via a live webcast from a link on Nova’s Investor Relations website – https://www.novami.com/investors/events/. Management will be available for one-on-one in-person meetings on both January 13 and 14. To schedule a meeting please contact your Needham salesperson.
To attend the conference call, please dial one of the following numbers at least five minutes before the conference call commences. If you are unable to connect using the toll-free numbers, please try the international dial-in number.
U.S. TOLL-FREE: 1-833-816-1427
ISRAEL TOLL-FREE: 1-80-9213284
INTERNATIONAL: 1-412-317-0519
WEBCAST LINK: https://event.choruscall.com/mediaframe/webcast.html?webcastid=O4EPlex6
At:
8:30 a.m. Eastern Time
5:30 a.m. Pacific Time
The conference call will also be available via a live webcast from a link on Nova’s Investor Relations website – https://www.novami.com/investors/events/. A replay of the conference call will be available from February 12, 2026, to February 19, 2026. To access the replay, please dial one of the following numbers:
Replay TOLL-FREE: 1-877-344-7529
Replay TOLL/INTERNATIONAL: 1-412-317-0088
Replay Pin Number: 7285579
Join us for, SPIE Advanced Lithography & Patterning, on February 22-26 2026, in San Jose, California, US