Chemical Metrology

With the acquisition of ancosys, Nova offers a market-leading portfolio of advanced, open and flexible chemical metrology platforms for semiconductor backend wafer-level packaging and front-end damascene process steps as well as PC board copper plating. Nova’s chemical metrology offering helps manufacturers ensure high-quality electroplating processes by carrying out real-time chemical analysis and replenishment.

The number of interconnect steps that require plating at the front-end of the process has grown significantly in the past few years, as has the demand for material purity. Over the same period, there has been a substantial increase in the number of organic alloys and compounds used in advanced packaging, leading to a growing number of analytic methods being employed. These trends raise the bar on metrology complexity, leading to reduced process windows and increased monitoring frequency - from hours to minutes.

New device architectures, higher material costs, and tighter environmental regulations are driving up the costs of operations and increasing the need for manufacturers to carry out chemical process control on more elements and with increasing intensity. With Nova’s extended offering, now customers can harness the company’s global footprint to meet their metrology needs.