Products Overview Dimensional Metrology
Nova SemDex Series 

Nova SemDex Series 

Multi-sensor Wafer Metrology Platforms for Advanced Packaging

Nova SemDex A

The Nova SemDex series is a family of optical wafer metrology platforms designed to support Advanced Packaging processes. The multi-sensor metrology system of all SemDex series tools is highly versatile, with measuring instruments based on optical interferometry, reflectometry, and microscopy techniques to measure critical geometric dimensions of wafers From fully automated to semi-automated and manual handling, SemDex’s diverse range of metrology solutions is designed to satisfy the needs of different manufacturing scales, productivity, and cost requirements while supporting a wide range of applications 

Highlights and Benefits

Best-In-Class TCO

Modular Design

Flexible Handling

Automated Workflows

Best-In-Class TCO

Modular Design

Flexible Handling

Automated Workflows

Best-In-Class TCO

The Nova SemDex versatile offering allows best-in-class TCO for different manufacturing scales and productivity requirements, from R&D to High-Volume Manufacturing environments.

Modular Design

All Nova SemDex tools feature a modular, multi-sensor metrology system that allows for the coverage of a wide range of advanced packaging applications.

Flexible Handling

Designed to support different wafer sizes, framed and warped wafers. With customizable load port configurations and end effectors, Nova SemDex can handle multiple advanced packaging scenarios.

Automated Workflows

With SEMI-compliant connectivity, it integrates seamlessly into fabs’ automation environments, while supporting automatic recipe loading and centralized recipe management for efficient operation.

Why Nova SemDex? 

Nova SemDex Series is a cutting-edge family of multi-sensor wafer metrology platforms tailored for Advanced Packaging. Combining high-end optical technologies—interferometry, reflectometry, and microscopy, Nova SemDex delivers precise, reliable measurements across diverse manufacturing needs.

With models like Nova SemDex A, M2, and M1, the series offers a versatile offering of scalable solutions. Flexibly designed, Nova SemDex supports various wafer sizes, framed, and warped wafers with customizable load ports and end effectors. Its SEMI-compliant automation and centralized recipe management ensure seamless fab integration and high throughput. 

Nova SemDex A

Nova SemDex A  

Nova SemDex A is a fully automated wafer metrology tool developed for the semiconductor industry to provide process reliability and quality assurance. Both wafer handling and the metrology part perform automatically.  

Nova SemDex A automates all metrology wafer handling for any size (wafer diameter from 100 mm to 330 mm) and type (blanked and patterned, bonded, taped, and framed wafer) and connects the whole metrology via SECS/GEM to the fab host.  

Nova SemDex A is optimized for high-volume manufacturing fabs and offers full support for OHT (Overhead Hoist Transport) integration. 

Nova-SemDex M2

Nova SemDex M2 

 Nova SemDex M2 offers similar capabilities to Nova SemDex A, but with a single load port. Wafer handling can be either manual or fully automated. It thus provides a cost-effective solution for customers with lower production volumes.  

Nova SemDex M2 automates all metrology wafer handling for any size (wafer diameter from 100 mm to 330 mm) and type (blanked and patterned, bonded, taped, and framed wafer). 

Nova-SemDex M1

Nova SemDex M1  

Nova SemDex M1 is a semi-automated wafer metrology tool. While wafer handling is manual, the metrology process is performed automatically. Combined with its small footprint, Nova SemDex M1 is ideal for R&D and very low production volumes. 

Applications

Backside Silicon Thickness

Pre/post grind and post CMP Silicon thickness, covering a range of 1 to 1000 µm. High-throughput measurements with full wafer mapping for complete thickness profile analysis. 

Wafer Warpage

Detailed full-wafer warpage mapping provides a comprehensive view of wafer deformation. Bow measurements are performed at selected key points to quickly assess wafer curvature. 

Bond Layer TTV

Single-layer measurements can be performed on multi-layer samples, such as the adhesive bond layer between the wafer and the carrier. Bonding eccentricity is also detectable for alignment analysis. 

Topography Analysis

Geometric parameters such as Critical Dimension (CD), height, and distance can be measured, including features like RDLs, bumps, and laser grooves. 

Die Warpage (3D, D2W)

Die warpage and thickness can be measured, typically in cases like framed wafers after dicing. Key results include metrics such as SFQR, SBIR, and others. 

Planar Thin Film

Fast full-wafer mapping enables efficient measurement of thin film thickness and calculates the Total Thickness Variation (TTV) across the entire wafer. 

The measurement instrument can evaluate the thickness of up to four thin layers, down to 5 nm, either on test windows of a product wafer or across a blank wafer. 

Backside Silicon Thickness
Backside Silicon Thickness
Wafer Warpage
Wafer Warpage
Bond Layer TTV
Bond Layer TTV
Topography Analysis
Topography Analysis
Die Warpage (3D, D2W)
Die Warpage (3D, D2W)
Planar Thin Film
Planar Thin Film