Measure the Invisible to Deliver Deep Process Insight
Nova’s advanced multi-disciplinary dimensional metrology technologies combine complex opto-mechanical hard-ware with advanced optics and leading-edge algorithms, which deliver continuous innovation for effective process control throughout the semiconductor fabrication lifecycle. Nova’s technical innovation and market leadership enable customers to improve process performance, enhance products’ yields and accelerate time to market
Inline Platforms for Composition and Film Thickness Measurements
Nova is a market leader for innovative thin film metrology and process control innovations. Our technologies enable customers to accurately detect and quantify small variations in film composition and thickness, thereby influencing better device functionality, and improved manufacturing yield.
Nova offers a market-leading portfolio of advanced, open and flexible chemical metrology platforms for backend wafer-level packaging and front-end damascene process steps. Our portfolio helps manufacturers ensure high-quality electroplating processes by carrying out chemical analysis and replenishment in real time.
Pioneering Holistic Approach to Modeling Driven Insights
Nova’s cutting-edge metrology software modeling technology provides the most comprehensive algorithmic solutions for application development including model-based, machine learning and advanced Hybrid Metrology algorithms that enable high-performance metrology and deliver breakthrough performance in Time-To-Solution (TTS) and accuracy for the most complex 3D structures