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Overview

The Future of Process Control

Nova’s innovative metrology products provide high-value solutions for
the semiconductor industry’s most challenging applications.

Deposition
Lithography
Etch
CMP

CMP

Chemical Mechanical Planarization (CMP) is used to planarize, or flatten, a wafer surface using a combination of mechanical forces and chemical reactions. Nova’s advanced optical metrology solutions not only address the high throughput requirements needed to maintain wafer planarity, but also meet the increased process complexity challenges of today’s CMP applications.

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Etch

In semiconductor manufacturing, the etch process creates patterned features on the wafer by selectively removing material. New patterning technologies and a significant increase in structural complexity require innovative metrology solutions like those provided by Nova’s optical metrology, x-ray metrology, and software products.

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Deposition

The ability to deposit thin films of materials onto a substrate is the structural foundation of semiconductor technology. Nova’s optical and x-ray metrology products provide a wide range of solutions to address the film thickness and composition control requirements of the deposition sector.

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Lithography

In the semiconductor industry, lithography (often called “litho”) is the process of creating a microscopic pattern of the desired circuitry onto a wafer. The high throughput, full-profile metrology requirements of lithography are met with Nova’s stand-alone optical scatterometry systems that measure photoresist non-destructively with excellent precision and accuracy.

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