Nova WMC is a high-end optical metrology platform designed to support 2.5D and 3D Advanced Packaging processes. Through the highly versatile modularity of its advanced metrology, handling, and loading systems, it combines precision, accuracy, and high throughput for outstanding performance at an unmatched Cost of Ownership. The platform’s unique ability to address major challenges such as high warpage, non-symmetric shapes, and different surface conditions, all in one tool, makes it the ultimate choice for 2.5D/3D packaging and HBM manufacturers.
Why Nova WMC?
Nova WMC redefines wafer metrology for advanced packaging by delivering a unified solution to the most complex challenges in 2.5D/3D integration and HBM manufacturing. Built on a modular, future-ready architecture, it seamlessly adapts to evolving process demands while maintaining exceptional precision and throughput. Its unique multi-sensor approach—featuring in-house-developed optical technologies—enables accurate, repeatable measurements across diverse surface conditions, including warped or non-uniform surfaces. Nova WMC’s versatility extends to handling a wide range of wafer sizes and formats, ensuring compatibility with the full spectrum of advanced packaging workflows. With robust automation, SEMI-compliant integration, and scalable performance, Nova WMC empowers fabs to accelerate yield, reduce cost of ownership, and confidently navigate the next generation of semiconductor innovation.
