Plating Bath Process Control Solutions for Semiconductor and Packaging Manufacturers
Nova offers a market-leading portfolio of advanced, in-line chemical metrology solutions for monitoring, analyzing, and replenishing plating baths for semiconductor and packaging manufacturers.
Nova AncoScene®
Chemical Metrology for BEOL Cu Dual-Damascene Plating
- POR at world-leading foundries
- Supports all copper damascene and TSV chemistries
- By-Products & Contaminants Detection
- Bath Performance Indicator
Small Footprint
Effective Fab Space
Secured through
Barcode Verification
Nova Ancolyzer®
Leading Process Control Platform for WLP/AP Plating Chemistry
- POR at world-leading foundries
- Supports all known chemistries including:
- Electroplating – Cu, Ni, SnAg, Sn, Au, In
- Eless plating – Ni, Pd, Au, Cu
- By-Products & Contaminants Detection
- Bath Performance Indicator
Modular, Field
Extendable System
Liquid & Powder
Replenishments Integration
Used by Leading Logic/Foundry, Memory, and Packaging Manufacturers WW
Harnessing over two decades of technological excellence and leadership, Nova offers both industry-standard and unique technologies to provide the insight and control you need for high-yield, quality plating processes.
Fully Automated
Low Cost of Ownership
Open Data Access
Outstanding Acc and RSD performance